Izixhobo zedayimani ezifakwe ngombanebhekisa kwizixhobo zedayimani ezisongelwe ngokuqinileyo yi-matrix metal kwi-substrate (intsimbi okanye ezinye izinto) nge-electrodeposition yesinyithi, zisetyenziswa kakhulu kwi-electronics zoomatshini, iglasi, izixhobo zokwakha, ukubhola ioyile, kunye neminye imboni. Izixhobo zedayimani ezifakwe ngombane zidlala indima ebalulekileyo kumashishini ahlukeneyo afana ne-mechatronics, iglasi, izixhobo zokwakha, ukubhola ioyile, njl. Ezi zixhobo zenzelwe ukubonelela ngokusebenza kakuhle, ubomi obude, kunye nobuchule bokugaya obuchanekileyo.
Ukuze kufezekiswe ezi mpawu zifunwayo, isinyithi esifakwe kwisixhobo akufuneki sibe nobunzima obuphezulu kunye nokumelana nokuguguleka kuphela kodwa kufuneka sisasazwe ngokulinganayo kuyo yonke i-substrate. Olu lwabiwo lulinganayo lubalulekile ukuthintela ukuqhekeka kwengubo kwaye lufinyeze ubomi besixhobo. Amashishini athile, anjengezinto zemagnethi kunye nokugaywa kwe-ceramic, aneemfuno ezithile zokubopha phakathi kwentsimbi efakwe kwi-substrate yentsimbi. Umzekelo, kushishino lwezinto zemagnethi, ukugaywa kwepowder kwenziwa ngesantya sokutya esilawulwayo esimalunga ne-0.3mm. Ngokufanayo, ishishini le-ceramics lisebenzisa iindlela zokugaywa ezomileyo ezifuna ukubopha okuqinileyo phakathi kwentsimbi efakwe kwi-substrate yentsimbi. Ngexesha lokuveliswa kwezixhobo zedayimani ezifakwe kwi-electroplated, abavelisi badla ngokubeka phambili uhlobo lwentsimbi efakelwe kwi-coating, ubunzima, kunye nokumelana nokuguguleka, kodwa bahlala bengayinaki imiba ebalulekileyo yokuqinisekisa ukubopha okuqinileyo phakathi kwentsimbi efakelwe kwi-substrate. Ke ngoko, akuqhelekanga ukuba izixhobo ziqhekeke ngexesha lokusetyenziswa kwangempela. Eli phepha lihlalutya izizathu zale ngxaki kwaye lixoxe ngokufutshane ngezisombululo.
Iintlobo ezintathu zeengubo ezifakwe kwizixhobo zedayimani ezifakwe ngombane zezi:
Ukuhlukana kwengubo kumphezulu we-substrate: Ingubo yesinyithi equlethe idayimani kunye nengubo yesinyithi engenadayimani zisuswa ngaxeshanye kwi-substrate yesinyithi.
Ukuqhekeka kweleya kwi-undercoat yesinyithi: I-undercoat yesinyithi engenadayimani ihlala inamathele kwi-substrate yesinyithi, ngelixa i-metal coating enedayimani iqhekeka kwi-undercoat yesinyithi.
Ukwahlulwa kunye nokwahlulwa kwesinyithi esigqumayo kwisinyithi esiqulathe idayimani: isinyithi esigqumayo kwindawo yokudibana kwesixhobo somsebenzi asinxitywanga ngokuqhelekileyo, kodwa siyawa kwimo ye-flake okanye i-powder, ngelixa amasuntswana edayimani engasuswanga ngokupheleleyo. Olu hlobo lokuqhekeka ludla ngokungaqatshelwa, okukhokelela kwimibono engeyiyo yokunamathela okungalunganga okanye ukumelana nokuguguleka kwesinyithi esigqumayo. Iimbobo ezinkulu eziqhubekayo kumphezulu wesixhobo zinokubonisa olu hlobo lokuqhekeka xa iinkozo zedayimani ziqhekeka ngexesha lokusetyenziswa kwesixhobo okuqhelekileyo.
Ukuqonda olu hlobo lokuchitha kunokunceda ekuchongeni iingxaki ezithile kwaye kuthathwe amanyathelo afanelekileyo ukuphucula amandla okubopha kunye nokuqina kwezixhobo zedayimani ezifakwe ipleyiti.
Izizathu zokuqhekeka kwepleyiti:
Unyango lwangaphambi kokufaka ipleyiti ludlala indima ebalulekileyo ekunamatheleni nasekusemgangathweni kwengubo kwi-substrate yentsimbi. Ezi zilandelayo zezinye zeziphumo zonyango lwangaphambi kokufaka ipleyiti: Ukucoca umphezulu: ukupolisha ngoomatshini kunye nokususa amafutha ukuze kususwe izinto zangaphandle, ioyile, kunye nezinye izinto ezingcolisayo kumphezulu we-substrate. Oku kuqinisekisa ukuba ipleyiti inamathela ngqo kumphezulu wesinyithi ngaphandle kokungcola. Ukungaphumeleli ukucoca umphezulu ngokufanelekileyo kunokubangela ukunamathela okungafanelekiyo kunye nokuqhekeka kwengubo. Ukususwa kweFilimu ye-Oxide: Ukuqhekeza yinkqubo yokususa umaleko wefilimu ye-oxide owenziwe kwi-substrate ngenxa yokuvezwa emoyeni okanye kwezinye izinto ezingqongileyo. Ngaphambi kokufaka ipleyiti ye-electroplating, olu maleko we-oxide kufuneka lususwe ukuze kubonakale umphezulu wesinyithi ongaphantsi. Ukuba ifilimu ye-oxide ayisuswanga ngokufanelekileyo, iya kuthintela ukwakheka kwebhondi eqinileyo phakathi kwesinyithi sokufaka ipleyiti kunye nesinyithi esisisiseko, okubangela ukunamathela okungafanelekiyo. Ukuvuselela: Ukuvuselela kwenziwa ukuze kubonelelwe umphezulu osebenzayo ngokweekhemikhali nococekileyo kwinkqubo yokufakela ipleyiti. Kukhuthaza ukunamathela kwengubo ngokuphucula ibhondi phakathi kwe-substrate kunye nezinto zokufaka ipleyiti. Iinkqubo zokuvuselela ezifana nokucola okanye ukucoca nge-electro zisusa naziphi na iileya ze-oxide eziseleyo kwaye zenze iimeko ezithile zomphezulu eziphucula ukunamathelana phakathi kwe-substrate kunye nokwaleka. Ngokubanzi, unyango oluhle lokulungiselela luqinisekisa ukuba umphezulu we-substrate ucocekile, awunazo izinto ezingcolisayo, kwaye usebenza ngokufanelekileyo. Oku kukhuthaza unxibelelwano oluqinileyo phakathi kokwaleka kunye ne-substrate ukuze kugqitywe umgangatho ophezulu nohlala ixesha elide. Ngokwahlukileyo koko, unyango olubi lokulungiselela lunokubangela iingxaki zokunamathelana, ukungaphumeleli kokwaleka, kunye nokusebenza okunciphileyo kwemveliso.
Ukongeza kunyango olubi lwe-pre-plating, izizathu zokuxobuka kwengubo zezi zilandelayo:
Ukulungiswa komphezulu okunganelanga: Ukongeza ekulungisweni kwangaphambili kokugqunywa, umphezulu we-substrate kufuneka ucocwe kakuhle kwaye ulungiswe ukuqinisekisa ukunamathelana ngokufanelekileyo kwe-plating. Naluphi na ungcoliseko okanye ukungalungelelani komphezulu kunokuthintela unxibelelwano phakathi kwengubo kunye ne-substrate, okubangela ukuqhekeka.
Ubukhulu bePlating obunganelanga: Ubukhulu bePlating bufanele ukuba bufanele ukusetyenziswa okucetywayo. Ukuba i-plating incinci kakhulu, isenokunganamatheli kwi-substrate ngamandla aneleyo, nto leyo ebangela ukuxobuka. Ubukhulu be-coating bufanele bulawulwe ngaphakathi koluhlu oluchaziweyo ukuqinisekisa ukunamathelana okuhle.
Umgangatho ophantsi wezinto zokugquma: Umgangatho wezinto zokugquma ezisetyenzisiweyo uya kuchaphazela ukunamathela kwe-plating. Ukuba izinto zokugquma zikumgangatho ophantsi okanye azinazo iimpawu ezifunekayo, zisenokungadibani kakuhle ne-substrate, nto leyo ebangela ukuba ziqhekeke.
Isikhuthazi sokuncamathelisa esinganelanga: Izikhuthazi zokuncamathelisa okanye ii-bonding agents zihlala zisetyenziswa phakathi kwe-substrate kunye ne-coating ukuphucula ukunamathela. Ukungasebenzisi okanye ukusetyenziswa gwenxa kwezikhuthazi zokunamathela kunokubangela ukunamathela okubi kunye nokuxobuka kwe-plating emva koko.
Iiparamitha zenkqubo ye-electroplating engafanelekanga: Kubalulekile ukwenza ngcono iiparamitha zenkqubo ye-electroplating, ezinje ngoxinano lwangoku, ubushushu, ixesha le-plating, njl.njl., ukuze kufunyanwe ukunamathela okuhle. Ukuba ezi paramitha azimiselwanga ngokuchanekileyo, ukunamathela okubi kunye nokuxobuka kwe-plating kunokubangela.
Ixesha lokuthumela: Julayi-27-2023