Amathuluzi edayimane afakwe ngogesiUma ubheka amathuluzi edayimane ahlanganiswe ngokuqinile ngensimbi ye-matrix ku-substrate (insimbi noma ezinye izinto) ngokuma kwe-electrode yensimbi, asetshenziswa kabanzi kuma-electronics emishini, ingilazi, izinto zokwakha, ukubhoboza uwoyela, kanye neminye imboni. Amathuluzi edayimane afakwe ngogesi adlala indima ebalulekile ezimbonini ezahlukahlukene ezifana ne-mechatronics, ingilazi, izinto zokwakha, ukubhoboza uwoyela, njll. Lawa mathuluzi aklanyelwe ukuhlinzeka ngokusebenza kahle okuphezulu, impilo ende, kanye namakhono okugaya anembile.
Ukuze kufezwe lezi zimfanelo ezifiselekayo, insimbi efakwe insimbi akumele nje ibe nobunzima obukhulu kanye nokumelana nokuguguleka kodwa futhi kufanele isatshalaliswe ngokulinganayo kuyo yonke i-substrate. Lokhu kusatshalaliswa okufanayo kubalulekile ukuvimbela ukuqhekeka kwengubo futhi kufinyeze impilo yonke yethuluzi. Izimboni ezithile, njengezinto ezisebenza ngogesi kanye nokugaya nge-ceramic, zinezidingo ezithile zokubopha phakathi kwensimbi efakwe insimbi kanye ne-substrate yensimbi. Isibonelo, embonini yezinto ezisebenza ngogesi, ukugaya ngempuphu kwenziwa ngesilinganiso sokudla esilawulwayo esingaba ngu-0.3mm. Ngokufanayo, imboni yezinto ezisebenza ngogesi isebenzisa amasu okugaya okomile aphezulu adinga isibopho esiqinile phakathi kwensimbi efakwe insimbi kanye ne-substrate yensimbi. Ngesikhathi sokukhiqizwa kwamathuluzi edayimane afakwe ngogesi, abakhiqizi bavame ukunikeza kuqala uhlobo lwensimbi efakwa insimbi, ubulukhuni, kanye nokumelana nokuguguleka, kodwa bavame ukunganaki izici ezibalulekile zokuqinisekisa isibopho esiqinile phakathi kwensimbi efakwa insimbi kanye ne-substrate. Ngakho-ke, akuvamile ukuthi amathuluzi aqhekeke ngesikhathi sokusetshenziswa kwangempela. Leli phepha lihlaziya izimbangela zale nkinga futhi lixoxe kafushane ngezixazululo.
Izinhlobo ezintathu zezingubo ezihlanganisiwe kumathuluzi edayimane afakwe ngogesi yilezi:
Ukuhlukaniswa kwesembozo ebusweni be-substrate: Isembozo sensimbi esiqukethe idayimane kanye nesembozo sensimbi esingenadayimane zisuswa ngasikhathi sinye kwisembozo sensimbi.
Ukuqhekeka kwesendlalelo esingaphansi kwensimbi: Isendlalelo sensimbi esingenadayimane sihlala sinamathele esisekelweni sensimbi, kuyilapho isendlalelo sensimbi esiqukethe idayimane siqhekeka esingaphansi kwensimbi.
Ukuhlukaniswa kanye nokuhlukaniswa kwensimbi yokumboza embozweni wensimbi oqukethe idayimane: insimbi yokumboza endaweni yokuxhumana yento yokusebenza ayigqokwa ngokujwayelekile, kodwa iyawa ngesimo se-flake noma i-powder, kuyilapho izinhlayiya zedayimane zingahlukani ngokuphelele. Lolu hlobo lokuqhekeka luvame ukunganakwa, okuholela emibonweni engamanga yokunamathela okungekuhle noma ukumelana nokuguguleka kwensimbi embozwe. Ama-pores amakhulu aqhubekayo ebusweni bethuluzi angabonisa lolu hlobo lokuqhekeka lapho izinhlamvu zedayimane ziphuka ngesikhathi sokusetshenziswa okuvamile kwethuluzi.
Ukuqonda lezi zinhlobo zokuphanga kungasiza ekuboneni izinkinga ezithile futhi kuthathwe izinyathelo ezifanele zokuthuthukisa amandla okubopha kanye nokuqina kwamathuluzi edayimane afakwe insimbi.
Izimbangela zokususwa kwe-plating:
Ukwelashwa kwangaphambi kokufaka i-plating kudlala indima ebalulekile ekunamatheleni nasekhwalithini kwe-coating ku-substrate yensimbi. Lokhu okulandelayo yimiphumela ethile yokwelashwa kwangaphambi kokufaka i-plating: Ukuhlanza indawo: ukupholisha ngomshini nokususa amafutha ukuze kususwe izinto zangaphandle, uwoyela, kanye nezinye izinto ezingcolisayo ebusweni be-substrate. Lokhu kuqinisekisa ukuthi i-plating inamathela ngqo ebusweni bensimbi ngaphandle kokungcola. Ukwehluleka ukuhlanza indawo ngokwanele kungabangela ukunamathela okubi nokuqhekeka kwe-coating. Ukususwa kwe-Oxide Film: Ukuqopha inqubo yokususa ungqimba lwefilimu ye-oxide olwakhiwe ku-substrate ngenxa yokuchayeka emoyeni noma kwezinye izici zemvelo. Ngaphambi kokufaka i-electroplating, lolu ngqimba lwe-oxide kumele lususwe ukuze kuvele ubuso bensimbi obungaphansi. Uma ifilimu ye-oxide ingasuswa ngempumelelo, izovimbela ukwakheka kwesibopho esiqinile phakathi kwensimbi yokumboza nensimbi eyisisekelo, okuholela ekunamatheleni okubi. Ukuqalisa: Ukuqalisa kwenziwa ukuze kuhlinzekwe ubuso obusebenzayo ngamakhemikhali nobuhlanzekile benqubo yokumboza. Kukhuthaza ukunamathela kwe-coating ngokuthuthukisa isibopho phakathi kwe-substrate nezinto zokumboza. Izinqubo zokuqalisa ezifana nokukha noma ukuhlanza nge-electro zisusa noma yiziphi izingqimba ze-oxide ezisele futhi zidale izimo ezithile zobuso ezithuthukisa ukunamathelana phakathi kwe-substrate kanye nokugqoka. Sekukonke, ukwelashwa okuhle kokulungiselela kuqinisekisa ukuthi ubuso be-substrate buhlanzekile, abunazo izinto ezingcolisayo, futhi busebenza kahle. Lokhu kukhuthaza isibopho esiqinile phakathi kokugqoka kanye ne-substrate ukuze kuqedwe kahle futhi kuhlale isikhathi eside. Ngakolunye uhlangothi, ukwelashwa okubi kokulungiselela kungaholela ezinkingeni zokunamathelana, ukwehluleka kokugqoka, kanye nokusebenza komkhiqizo okuncishisiwe.
Ngaphezu kokwelashwa okungekuhle kokufakwa kwe-plating, izizathu zokuqhekeka kwe-coating yilezi ezilandelayo:
Ukulungiswa Komphezulu Okwanele: Ngaphezu kokwelashwa kokufakwa kweplati, umphezulu we-substrate kufanele uhlanzwe kahle futhi ulungiswe ukuqinisekisa ukunamathela okufanele kweplati. Noma yikuphi ukungcola noma ukungahleleki komphezulu kungaphazamisa ukubopha phakathi kwengubo ne-substrate, okubangela ukuqhekeka.
Ubukhulu Bokumboza Obunganele: Ubukhulu bokumboza kufanele bufanele ukusetshenziswa okuhlosiwe. Uma ukumboza kuncane kakhulu, kungase kunganamatheli ku-substrate ngamandla anele, okubangela ukuxebuka. Ubukhulu bokumboza kufanele bulawulwe ngaphakathi kobubanzi obubekiwe ukuqinisekisa ukunamathela okuhle.
Ikhwalithi yezinto zokumboza ephansi: Ikhwalithi yezinto zokumboza ezisetshenziswayo izothinta ukunamathela kwe-plating. Uma izinto zokumboza zisezingeni eliphansi noma zingenazo izakhiwo ezidingekayo, zingase zingabophi ngokwanele ku-substrate, okuholela ekuqhekekeni.
Ukunganeli kokunamathela okukhuthazwayo: Ama-promoter okunamathelayo noma ama-bonding agents avame ukusetshenziswa phakathi kwe-substrate kanye ne-coating ukuze kuthuthukiswe ukunamathela. Ukwehluleka ukusebenzisa noma ukusebenzisa kabi ama-promoter okunamathelayo kungabangela ukunamathela okubi kanye nokuqhekeka kwe-plating okulandelayo.
Amapharamitha enqubo ye-electroplating angalungile: Kuyadingeka ukwenza ngcono amapharamitha enqubo ye-electroplating, njengobuningi bamanje, izinga lokushisa, isikhathi se-plating, njll., ukuze kutholakale ukunamathela okuhle. Uma la mapharamitha engabekwanga kahle, ukunamathela okubi kanye nokuxebuka kwe-plating kungabangela.
Isikhathi sokuthunyelwe: Julayi-27-2023